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Senior IC Product engineering (Beijing)
Type: Full-time
Location: Beijing
Experience: 3-5 years
Degree: Master’s or above
Language: English (Fluent)
Job Description
Responsibilities:
New product package design, familiar with BGA, QFP, QFN and Sip package technical New product qualification, familiar with HTOL, HAST, PCT, TC, etc. standard and method Yield improvement with test method changes Failure analysis, reliability board design and make out qual plan Familiar with Foundry/Assembly/Testing house is preferred
Skills:
Multi-tasking skills required, especially in dealing with multiple products. Must be able to maintain day-to-day responsibilities while addressing "hot" issues. Strong team work skills are required. Proficiency communication skill in English is needed.
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