DXC Technology Names Chris Drumgoole as Chief Information Officer

DXC Technology (NYSE: DXC) today announced that Chris Drumgoole has been named executive vice president and chief information officer. Drumgoole, who previously served as chief information officer at GE, will report to Mike Salvino, DXC’s president and chief executive officer. Drumgoole’s appointment represents the seventh addition to Salvino’s senior leadership team since he became CEO in September of last year. In his role, Drumgoole will lead DXC’s global IT strategy and operati...

DXC Technology Names Chris Drumgoole as Chief Information Officer

DXC Technology (NYSE: DXC) today announced that Chris Drumgoole has been named executive vice president and chief information officer. Drumgoole, who previously served as chief information officer at GE, will report to Mike Salvino, DXC’s president and chief executive officer. Drumgoole’s appointment represents the seventh addition to Salvino’s senior leadership team since he became CEO in September of last year. In his role, Drumgoole will lead DXC’s global IT strategy and operati...

키옥시아, 5세대 BiCS FLASH 공개

세계 메모리 솔루션 분야를 선도하는 키옥시아(Kioxia Corporation)가 112층 3차원 수직 적층 구조 플래시 메모리 5세대 빅스 플래시(BiCS FLASH™)를 성공적으로 개발했다고 30일 발표했다. 키옥시아는 2020년 1분기에 특정 애플리케이션을 위해 3중셀(triple-level cell, TLC) 기술 기반 512기가비트(64기가바이트) 용량의 새로운 제품 샘플을 출하할 계획이다[*1]. 신제품은 기존의 모바일 기기, ...

키옥시아, 5세대 BiCS FLASH 공개

세계 메모리 솔루션 분야를 선도하는 키옥시아(Kioxia Corporation)가 112층 3차원 수직 적층 구조 플래시 메모리 5세대 빅스 플래시(BiCS FLASH™)를 성공적으로 개발했다고 30일 발표했다. 키옥시아는 2020년 1분기에 특정 애플리케이션을 위해 3중셀(triple-level cell, TLC) 기술 기반 512기가비트(64기가바이트) 용량의 새로운 제품 샘플을 출하할 계획이다[*1]. 신제품은 기존의 모바일 기기, ...

키옥시아, 5세대 BiCS FLASH 공개

세계 메모리 솔루션 분야를 선도하는 키옥시아(Kioxia Corporation)가 112층 3차원 수직 적층 구조 플래시 메모리 5세대 빅스 플래시(BiCS FLASH™)를 성공적으로 개발했다고 30일 발표했다. 키옥시아는 2020년 1분기에 특정 애플리케이션을 위해 3중셀(triple-level cell, TLC) 기술 기반 512기가비트(64기가바이트) 용량의 새로운 제품 샘플을 출하할 계획이다[*1]. 신제품은 기존의 모바일 기기, ...

키옥시아, 5세대 BiCS FLASH 공개

세계 메모리 솔루션 분야를 선도하는 키옥시아(Kioxia Corporation)가 112층 3차원 수직 적층 구조 플래시 메모리 5세대 빅스 플래시(BiCS FLASH™)를 성공적으로 개발했다고 30일 발표했다. 키옥시아는 2020년 1분기에 특정 애플리케이션을 위해 3중셀(triple-level cell, TLC) 기술 기반 512기가비트(64기가바이트) 용량의 새로운 제품 샘플을 출하할 계획이다[*1]. 신제품은 기존의 모바일 기기, ...

Kioxia Corporation Unveils 5th-Generation BiCS FLASH™

Kioxia Corporation, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH™ three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Kioxia plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of calendar year 2020*1. The new device aims to fulfill ever-gr...

Kioxia Corporation Unveils 5th-Generation BiCS FLASH™

Kioxia Corporation, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH™ three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Kioxia plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of calendar year 2020*1. The new device aims to fulfill ever-gr...

Kioxia Corporation Unveils 5th-Generation BiCS FLASH™

Kioxia Corporation, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH™ three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Kioxia plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of calendar year 2020*1. The new device aims to fulfill ever-gr...

Kioxia Corporation Unveils 5th-Generation BiCS FLASH™

Kioxia Corporation, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH™ three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Kioxia plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of calendar year 2020*1. The new device aims to fulfill ever-gr...