Hitachi Chemical DuPont MicroSystems, Ltd. (hereinafter “the company”) announces that the company was granted permission to maintain the Japanese patents (Patent No. 6288227 and Patent No. 6206446; hereinafter “the patent group”) on polyimide precursor resin composition essential for manufacturing high heat-resistant, bendable flexible substrates on October 11 and November 25, respectively, in 2019 after examination by the Japan Patent Office in response to an opposition to the patent gr...